VLSI Systems #1 System design space P.J. Drongowski What is a system? The usual academic definition is "a physical object which performs some computational function. The system life cycle can be divided into three phases: * Development. * Manufacture. * Maintenance. System costs during the development and manufacturing stages belong to one of two categories: * Non-recurring: Costs which are incurred once when the system is designed. Non-recurring costs can be amortized during production. Large volume production increases the rate at which non-recurring costs can be amortized. * Recurring: Costs directly related to the production of deliverable systems. Recurring costs include material, labor, and capital. The selling price of a system is the sum of the recurring, per-unit cost of producing the system, the non-recurring development cost of the first system, and a reasonable profit. To complicate matters, systems are often designed against a subjective scale of performance versus selling price which is largely determined by the marketplace. Production volumes, amortization rate and desired market price will constrain development costs and will certainly affect certain engineering decisions. Maintenance costs are usually paid by the customer. However, if a product has a poor or expensive maintenance record, customers will not buy the system. Computer scientists tend to dwell on the logical behavior of information processing systems without considering the economics of the system life cycle. But, engineers who prepare products for the marketplace cannot ignore certain recurring and non-recurring costs and cost related factors. * Non-recurring. + Schedule. + Prototypes. * Recurring. + Mechanical. - Printed circuit board size, number of circuits per board. - Size and number of card slots in backplane. - Cabinets. + Cooling. + Power supply. - Generation. - Distribution. + Interconnection with other systems. Schedule. Time is money. Although an engineer's salary may be $30,000 per year, a burdened person-year may be as high as $70,000 for that same engineer. Schedule can only be reduced by making the engineering team more productive (i.e., to increase output per day) through improved design tools and techniques. A longer schedule will slow the amortization rate of development costs and may make the selling price of the product uncompetitive. Prototypes. Construction of a working prototype can be an expensive effort. Simulation can reduce prototyping costs by providing a soft testbed for system ideas. Mechanical. Every level of mechanical design (e.g., pin, circuit pack, board, backplane, cabinet) has some fixed cost associated with it. Generally, if more logical function can be packed within a physical unit, these fixed costs will be reduced. Cooling. Electrical systems do work and generate heat. This heat must be removed to prevent permanent damage to the system. Convection air cooling is the least expensive, forced air cooling is next, and fluid cooling is by far the most expensive method. Some circuits may require special packages to dissipate heat. Interconnection. Wires and backplane interconnections increase the capacitance along signal paths, and hence, increase switching time. Minimizing wire length and backplane connections will reduce switching times by reducing interconnection capacitance. Maintenance. Systems break. There is a trade-off between the time it takes to isolate a problem and part replacement. The more components there are in a system, the more likely something will malfunction. VLSI technology is a major advance since it reduces almost every major recurring system cost. * Basic production costs (per chip) are relatively low. * Mechanical. More functionality can be accommodated in smaller packages (chips) reducing board area, the number of PC boards, backplane interconnections, and cabinets. * Interconnection. If locality can be successfully exploited, on-chip interconnection capacitances are much lower than off-chip wire capacitances. Hence, circuits can switch faster. * Power supply. Since on-chip interconnection capacitances are lower, less power is required to charge/discharge wires. Hence, power consumption is lower. * Cooling. Lower power consumption may reduce system level costs for cooling. Higher circuit and current densities, however, may create a need for special cooling arrangements to prevent thermal damage to the individual chips. * Interconnection. Interconnection at the package, board and backplane levels will be reduced. The wires are not completely eliminated, making the interconnection of active circuitry on the individual chips more difficult. Other opportunities arise. * Since circuits can be produced inexpensively in volume, large numbers of processing and memory elements can be combined into extremely powerful configurations. * Design becomes more flexible. Logic enhanced memories (LEM's) which combine logic and memory together are particularly attractive since they are dense and fast. * Chip replacement maintenance and repair strategies become feasible. Further, redundant resources can be designed into a system to replace defective components on the fly. Non-recurring development costs are a problem. * Prototyping is very expensive. Simulation is a necessity. * Circuit layout (i.e., the spatial arrangement of the active circuitry) and wire routing are difficult and expensive design tasks. * Partitioning into function blocks is more difficult since relatively high or low wire capacitances can greatly affect system performance. => Most systems today work "correctly" the first time with respect to pure logical (0 and 1 behavior.) They usually do not operate fast enough, however. => This is why computer aided design (CAD) of VLSI systems is a hot topic! Technological alternatives in the design space. => Quick! What is the cheapest way to take advantage of VLSI technology? Answer: Buy a "high tech" part from your distributor. Custom. Chip area is totally uncommitted. Design primitives are transistors and wires. Custom has the maximum design flexibility. Cost effective in very large volumes due to high (non-recurring) design costs. Standard cells. Pre-designed logic circuits are stored in a computer-based library of standard cells. Chip area is uncommitted. Placement and routing may be partially automated. Libraries include PLA's, RAM, ROM, and even basic processors. Gate arrays. Chip geometry is predefined with a core of gate templates surrounded by interface circuits and pads. The gate templates are programmed using one or two mask layers (usually metal.) Can be used for random logic replacement. Fuse programmable logic arrays. Field programmable circuits are available off-the-shelf, usually implement a combinatorial function. Good for random logic replacement. Customization hierarchy % of wafer Development Prototype Technology pre-processed cost/chip lead time Full custom 0% $50K-$250K 9-18 months Standard cell 0% $30K-$90K 4-6 months Macro cell 80% $15K-$40K 3-4 months Gate array 80-90% $5K-$20K 1-2 months Fuse programmable 100% None Off the shelf Copyright (c) 1984 Paul J. Drongowski